2390 Tie Point Premium Solderless Breadboard with 4 Binding Posts, Metal Backplate Features DC/AC

Features DC/AC

DG1Z rack kits contain mounting ears rather than a shelf or enclosure

Standard configuration interface: USB Device

Tests TTL and CMOS displays pulse presence and logic states memory mode "freezes" pulse display catches pulses to 30ns or pulse trains to 20 MHz 1 M input impedance

such as practical experiments in engineering

2390 Tie Point Premium Solderless Breadboard with 4 Binding Posts, Metal Backplate Features DC/ACSolderless breadboard ideal for testing, prototyping and experimentation Contact Points: 2,390 Terminal Strips: 3 Bus Strips: 5 Binding Posts: 4 Features a sturdy aluminum backing Nickel plated clips Size: 9. 4" x 7. 7"